Flex-Rigid PCBs are a complicated product. An early phase of your requirements between your designers and our engineers will be of great advantage to contribute to the success of the PCB. This is usually not so necessary for a simple 4 or 6 layer
flex-rigid PCBs, but for more the complicated structures, technical guidance is important or perhaps even essential to optimise the design for manufacturability and to reduce costs.
Here are some most common ones:
Traditional flex-rigid structure: multi-layer combination of rigid and flexible circuit with three or more layers with plated-through holes. The capacity please see below.
Asymmetrical flex-rigid structures with the FPC on the outer layer of the rigid structure. This contains three or more layers with plated-through holes.
Multi-layer flex-rigid build-up with blind and buried vias as part of the rigid build-up. 2 layers of micro vias can be realised.
Please contact CS if you need further information or assistance, our engineers are happy to help you.
|Feature||CS Electronics Technical Specification|
|Number of Layers||2-20 Layers|
|Base Materials Supplier||Shengyi, Taiflex, Du Pont, Arlon, Nelco Ventec, Rogers|
|Materials||Pyralux, High CTI>600V, FR4, ALU, Copper clad, Low flow Prepregs, No Flow Prepregs, Dk Materials and Rogers Series|
|PCB thickness||0.3mm-3mm+/- 10%|
|Maximum Dimensions||406.4mm X 558.8mm|
|Outer Copper Thickness Weight||35µm - 105µm(1.0oz-3oz)|
|Inner Copper Thickness Weights||18µm - 105µm (0.5oz - 3oz)|
|Minimum Track and Gap||2mil/2mil depends on the copper weight|
|Burie/ Blind Vias||Yes|
|Surface Finishes Available||HASL (SnPb), HASL LF (SnNiCU), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic Gold, Gold Fingers, Hard Gold and EPIG, Soft Gold|
|Minimum Hole Size||Mechanical 0.15mm Laser Drill 0.1mm|
|Soldermask type LPI/Colour||Green, Yellow, Black, Blue, Red, White, Matt Green, Matt Blue, Matt Black|
|Peelable Soldermask/Colour||Peters SD 2955/Blue Green|
|Stencil||with and without frame|