CSE in relationship with their production partners is producing since years pcb`s with the constantly advancing miniaturisation and the increasingly complex circuits requirements, as well as components with high pin counts, are bringing the classic multilayer PCBs more and more to the physical limits of their possibilities.
HDI circuit boards offer finer line structures and smaller vias. The microvias thus create space and also have better electrical properties than classic "thick" vias or blind holes. CSE chose the best suppliers with the best equipment and experience for this technology.
By pressing additional layers with the SBU (Sequential Build Up) technique, signals can be connected and unbundled on the inner layers without blocking the space for components with high pin density. With a little experience and a good layout, these components can even be placed opposite each other on the PCB.
|Feature||CS Electronics Technical Specification|
|Number of Layers||4 - 64 Layers|
|Base Materials Supplier||KB, Shengyi, ISOLA, Rogers series, NanYa, Neltec, Panasonic, Bergquist, etc.|
|Materials||High Performance FR4, Halogen-free FR4, High CTI>600V, low Dk Materials and Rogers Series ALU and Copper Clad Material, etc.|
|PCB thickness||0.6mm - 10.0mm|
|Maximum Dimensions||650mm X 1185mm|
|Outer Copper Thickness Weight||35µm - 420µm (1oz - 12oz)|
|Inner Copper Thickness Weights||18µm - 245µm (0.5oz - 7oz)|
|Minimum Track and Gap||2mil/2mil depends on the copper weight|
|Burie/ Blind Vias||4-50 Layer|
|Surface Finishes Available||HASL (SnPb), HASL LF (SnNiCU), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic Gold, Gold Fingers, Hard Gold and EPIG, Soft Gold|
|Minimum Hole Size||Mechanical 0.15mm Laser Drill 0.1mm|
|Soldermask type LPI/Colour||Green, Yellow,Black,Blue,Red, White, Purple,Orange, Matt Green, Matt Blue, Matt Black|
|Peelable Soldermask/Colour||Peters SD 2955/Blue Green|
|Stencil||with and without frame|